Invention Grant
- Patent Title: Slit valve having increased flow uniformity
-
Application No.: US13764204Application Date: 2013-02-11
-
Publication No.: US09423042B2Publication Date: 2016-08-23
- Inventor: Chandrasekhar Balasubramanyam , Helder Lee , Miriam Schwartz , Elizabeth Wu , Kedarnath Sangam
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: F16K15/14
- IPC: F16K15/14 ; C23C16/44 ; C23C16/455 ; F16K51/02 ; H01L21/677

Abstract:
Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a substrate to pass therethrough; a gas inlet formed in the housing; an outer plenum disposed in the housing and coupled to the gas inlet; an inner plenum disposed in the housing and coupled to the outer plenum via a plurality of holes; and a plurality of gas outlets disposed in the housing and fluidly coupling the opening to the inner plenum.
Public/Granted literature
- US20130153807A1 SLIT VALVE HAVING INCREASED FLOW UNIFORMITY Public/Granted day:2013-06-20
Information query