Invention Grant
- Patent Title: Interbody implant system and method
- Patent Title (中): 体内植入系统和方法
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Application No.: US14203125Application Date: 2014-03-10
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Publication No.: US09427328B2Publication Date: 2016-08-30
- Inventor: Thomas E. Drochner , Jonathan E. Blackwell , Cristian A. Capote , Anthony J. Melkent , Michael J. Merves , Bret M. Wilfong
- Applicant: Warsaw Orthopedic, Inc.
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic, Inc.
- Current Assignee: Warsaw Orthopedic, Inc.
- Current Assignee Address: US IN Warsaw
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/30
Abstract:
An interbody endcap comprises at least one member configured for connection with an interbody implant. The at least one member has a thickness that permits bone growth therethrough and a uniform surface configuration that resists and/or prevents egress of bone graft from a cavity of the interbody implant. Systems and methods are disclosed.
Public/Granted literature
- US20150250607A1 INTERBODY IMPLANT SYSTEM AND METHOD Public/Granted day:2015-09-10
Information query
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