Invention Grant
US09427762B2 Gas injector and cover plate assembly for semiconductor equipment
有权
用于半导体设备的气体喷射器和盖板组件
- Patent Title: Gas injector and cover plate assembly for semiconductor equipment
- Patent Title (中): 用于半导体设备的气体喷射器和盖板组件
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Application No.: US14186429Application Date: 2014-02-21
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Publication No.: US09427762B2Publication Date: 2016-08-30
- Inventor: Tsan-Hua Huang , Tsung-Hsun Han , Paul Wong , Miao-Chan Wu
- Applicant: HERMES-EPITEK CORPORATION
- Applicant Address: TW Taipei
- Assignee: HERMES-EPITEK CORPORATION
- Current Assignee: HERMES-EPITEK CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Huffman Law Group, PC
- Priority: TW102106341A 20130223
- Main IPC: B05B1/24
- IPC: B05B1/24 ; B05B15/02 ; C23C16/44 ; C23C16/455

Abstract:
A gas injector and cover plate assembly includes a cover plate, a gas injector and a ceiling. The cover plate includes cooling fluid channels. The gas injector is configured to be located on the cover plate, and includes a gas distributor, a fluid-cooling gas transmitter, gas spraying plates and a conducting cone. The gas distributor distributes gases and a gas transmitter cooling fluid. The gas distributor includes a gas conduit for introducing a first gas. The fluid-cooling gas transmitter connects the gas distributor to introduce the gas transmitter cooling fluid to form cooling fluid walls and the first gas and the gases. The gas spraying plates and the conducting cone are located beneath the fluid-cooling gas transmitter.
Public/Granted literature
- US20140239091A1 Gas Injector and Cover Plate Assembly for Semiconductor Equipment Public/Granted day:2014-08-28
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