Invention Grant
- Patent Title: Semiconductor processing boat design with pressure sensor
- Patent Title (中): 半导体加工船设计采用压力传感器
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Application No.: US14159106Application Date: 2014-01-20
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Publication No.: US09427818B2Publication Date: 2016-08-30
- Inventor: Ai-Tee Ang , Hsiu-Jen Lin , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469 ; B23K1/00 ; B23K3/08

Abstract:
Presented herein is a device comprising a device processing boat comprising a base at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit, the at least one recess aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base and having the sensel configured to sense a clamping force applied by the cover to the at least one unit.
Public/Granted literature
- US20150206779A1 SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR Public/Granted day:2015-07-23
Information query
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