Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US14638785Application Date: 2015-03-04
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Publication No.: US09427964B2Publication Date: 2016-08-30
- Inventor: Isamu Togashi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2014-053652 20140317
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/14

Abstract:
Provided is a liquid ejecting head which includes head bodies aligned in a direction of liquid ejection surface thereof, a flow-path member in which distribution flow path is provided to supply liquid to the head bodies, and flexible wiring substrates connected to the head bodies. The distribution flow path extends in the first direction. In addition, the flexible wiring substrates adjacent in the first direction overlap when viewed from the first direction. The distribution flow path is disposed in an area on one side with respect to the flexible wiring substrates, in a direction perpendicular to the first direction in the liquid ejection surface.
Public/Granted literature
- US20150258789A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2015-09-17
Information query
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