Invention Grant
- Patent Title: Reactive hot melt adhesive
- Patent Title (中): 活性热熔胶
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Application No.: US14802395Application Date: 2015-07-17
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Publication No.: US09428677B2Publication Date: 2016-08-30
- Inventor: Wu Suen
- Applicant: Henkel IP & Holding GmbH
- Applicant Address: DE Duesseldorf
- Assignee: Henkel IP & Holding GmbH
- Current Assignee: Henkel IP & Holding GmbH
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Main IPC: C09J171/00
- IPC: C09J171/00 ; B32B37/18 ; B32B37/12 ; C09J5/06 ; C09J11/08 ; C09J191/06 ; C08G65/336 ; C09J171/02 ; C08L93/04

Abstract:
The present disclosure relates to silane reactive hot melt adhesive compositions including acid functional wax and basic functional wax; the production of such adhesives; and the use of such adhesives. The silane reactive hot melt adhesive compositions have improved green strength as compared to silane reactive hot melt adhesive compositions without the acid functional wax and basic functional wax.
Public/Granted literature
- US20150322311A1 Reactive Hot Melt Adhesive Public/Granted day:2015-11-12
Information query
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