Invention Grant
US09430002B2 Assembling structure for module and electronic device having it 有权
具有模块和电子设备的组装结构

Assembling structure for module and electronic device having it
Abstract:
A mounting structure for mounting a module and an electronic device having the structure are provided. The electronic device includes at least one module, a bracket having an opening configured to contain the at least one module, a support rib extended upwardly along a boundary of the opening to support an outer circumferential surface of the at least one module, and two stopper protrusions formed on the outer circumferential surface of the at least one module in a protrusion manner to support the at least one module being restrained by the bracket and prevent the at least one module from completely passing through the opening, wherein a lower portion of the at least one module is partially inserted into the opening of the bracket.
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