Invention Grant
- Patent Title: Assembling structure for module and electronic device having it
- Patent Title (中): 具有模块和电子设备的组装结构
-
Application No.: US14158120Application Date: 2014-01-17
-
Publication No.: US09430002B2Publication Date: 2016-08-30
- Inventor: Jong-Min Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: CN201320030993U 20130121; KR10-2013-0127886 20131025
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02

Abstract:
A mounting structure for mounting a module and an electronic device having the structure are provided. The electronic device includes at least one module, a bracket having an opening configured to contain the at least one module, a support rib extended upwardly along a boundary of the opening to support an outer circumferential surface of the at least one module, and two stopper protrusions formed on the outer circumferential surface of the at least one module in a protrusion manner to support the at least one module being restrained by the bracket and prevent the at least one module from completely passing through the opening, wherein a lower portion of the at least one module is partially inserted into the opening of the bracket.
Public/Granted literature
- US20140204538A1 ASSEMBLING STRUCTURE FOR MODULE AND ELECTRONIC DEVICE HAVING IT Public/Granted day:2014-07-24
Information query