Invention Grant
- Patent Title: Curable polymeric materials and their use for fabricating electronic devices
- Patent Title (中): 可固化聚合材料及其制造电子器件的用途
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Application No.: US14798443Application Date: 2015-07-13
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Publication No.: US09431234B1Publication Date: 2016-08-30
- Inventor: Shaofeng Lu , Damien Boudinet , Yu Xia , Wei Zhao , Antonio Facchetti
- Applicant: Polyera Corporation
- Applicant Address: US IL Skokie
- Assignee: Polyera Corporation
- Current Assignee: Polyera Corporation
- Current Assignee Address: US IL Skokie
- Agent Karen K. Chan
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/445 ; H01L51/05 ; H01L51/00

Abstract:
Disclosed are curable linear polymers that can be used as active and/or passive organic materials in various electronic, optical, and optoelectronic devices. In some embodiments, the device can include an organic semiconductor layer and a dielectric layer prepared from such curable linear polymers. In some embodiments, the device can include a passivation layer prepared from the linear polymers described herein. The present linear polymers can be solution-processed, then cured thermally (particularly, at relatively low temperatures) and/or photochemically into various thin film materials with desirable properties.
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