Invention Grant
- Patent Title: Wafer inversion mechanism
- Patent Title (中): 晶圆反转机制
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Application No.: US13723618Application Date: 2012-12-21
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Publication No.: US09431282B2Publication Date: 2016-08-30
- Inventor: Troy Palm
- Applicant: Rudolph Technologies, Inc.
- Applicant Address: US MA Wilmington
- Assignee: Rudolph Technologies, Inc.
- Current Assignee: Rudolph Technologies, Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/68
- IPC: H01L21/68 ; B25J15/00 ; H01L21/677 ; H01L21/687
Abstract:
A BOLTS compatible module includes a support mechanism for gripping a wafer. The support mechanism is coupled to a rotary mechanism for rotating the support mechanism with a wafer grip therein. The rotary mechanism is coupled to the module and capable of at least 180° of rotation.
Public/Granted literature
- US20130209211A1 WAFER INVERSION MECHANISM Public/Granted day:2013-08-15
Information query
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