Invention Grant
- Patent Title: Method of forming a semiconductor package
- Patent Title (中): 形成半导体封装的方法
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Application No.: US14503932Application Date: 2014-10-01
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Publication No.: US09431367B2Publication Date: 2016-08-30
- Inventor: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L25/03 ; H01L25/00 ; H01L25/065
Abstract:
A method of forming a semiconductor package includes forming an interconnecting structure on an adhesive layer, wherein the adhesive layer is on a carrier. The method further includes placing a semiconductor die on a surface of the interconnecting structure. The method further includes placing a package structure on the surface of the interconnecting structure, wherein the semiconductor die fits in a space between the interconnecting structure and the package structure. The method further includes performing a reflow to bond the package structure to the interconnecting structure.
Public/Granted literature
- US20150017764A1 METHOD OF FORMING A SEMICONDUCTOR PACKAGE Public/Granted day:2015-01-15
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