Invention Grant
- Patent Title: Semiconductor memory device and method for manufacturing the same
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US14847921Application Date: 2015-09-08
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Publication No.: US09431412B1Publication Date: 2016-08-30
- Inventor: Tatsuya Kato , Fumitaka Arai , Satoshi Nagashima , Katsuyuki Sekine , Yuta Watanabe , Keisuke Kikutani , Atsushi Murakoshi
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L27/115

Abstract:
According to one embodiment, a semiconductor memory device includes a first array extending in a first direction, a second array extending in the first direction, and a second electrode film. The second array is arranged with the first array in a second direction crossing the first direction. The second electrode film provided between the first array and the second array. The second electrode film extends in the first direction. Each of the first array and the second array include a first structure, a second structure arranged in the first direction, a fourth insulating film provided between the first structure and the second structure, and a third insulating film provided between the first structure and the second electrode film, provided also between the first structure and the fourth insulating film.
Information query
IPC分类: