A method of manufacturing an array substrate is disclosed. A first conductive pattern, a first insulating layer, a second conductive pattern, and a second insulating layer on a base substrate is successively formed. The second insulating layer and the first insulating layer are patterned with a double-tone mask. At least a half lap joint via hole in the second insulating layer, and at least a full lap joint via hole in both the first insulating layer and the second insulating layer is formed. The second conductive pattern corresponds to a part of the half lap joint via hole, and the first conductive pattern corresponds to the whole of the full lap joint via hole. A third conductivity pattern is formed on the surface of the second conductivity pattern and the first insulating layer and a fourth conductive pattern is formed on the surface of the first conductive pattern.