Invention Grant
- Patent Title: Overmolded reconstructed camera module
- Patent Title (中): 包覆成型重建相机模块
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Application No.: US14611950Application Date: 2015-02-02
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Publication No.: US09431442B2Publication Date: 2016-08-30
- Inventor: Julien C. Vittu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L27/146 ; H01L21/56
Abstract:
A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.
Public/Granted literature
- US20160225809A1 OVERMOLDED RECONSTRUCTED CAMERA MODULE Public/Granted day:2016-08-04
Information query
IPC分类:
