Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US14600142Application Date: 2015-01-20
-
Publication No.: US09431478B2Publication Date: 2016-08-30
- Inventor: Yeong-Jong Jeong , Jeong-Yun Lee , Geo-Myung Shin , Dong-Suk Shin , Si-Hyung Lee , Seo-Jin Jeong
- Applicant: Yeong-Jong Jeong , Jeong-Yun Lee , Geo-Myung Shin , Dong-Suk Shin , Si-Hyung Lee , Seo-Jin Jeong
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2014-0052532 20140430
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/78 ; B82Y10/00 ; H01L29/775 ; H01L29/41

Abstract:
A semiconductor device includes a first multi-channel active pattern defined by a field insulating layer and extending along a first direction, the first multi-channel active pattern including a first portion having a top surface protruding further in an upward direction than a top surface of the field insulating layer and a second portion on both sides of the first portion, the second portion having sidewalls with a continuous profile and a top surface protruding further in the upward direction than the top surface of the field insulating layer and protruding in the upward direction less than the top surface of the first portion, a gate electrode on the first portion of the first multi-channel active pattern and extending along a second direction different from the first direction, and a first source/drain region on the second portion of the first multi-channel active pattern and contacting the field insulating layer.
Public/Granted literature
- US20150318399A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-11-05
Information query
IPC分类: