Invention Grant
- Patent Title: Graphene layer transfer
- Patent Title (中): 石墨烯层转移
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Application No.: US13739511Application Date: 2013-01-11
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Publication No.: US09431487B2Publication Date: 2016-08-30
- Inventor: Ageeth A. Bol , Steven E. Steen , James Vichiconti
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/786 ; H01L29/66 ; H01L29/778

Abstract:
A method to transfer a layer of graphene from one substrate to another substrate is provided. The method includes providing a first layered structure including, from bottom to top, a copper foil, a layer of graphene, an adhesive layer and a carrier substrate. The copper foil is removed exposing a surface of the layer of graphene. Next, an oxide bonding enhancement dielectric layer is formed on the exposed surface of the layer of graphene. A second layered structure including a receiver substrate and a dielectric oxide layer is provided. Next, an exposed surface of the dielectric oxide layer is bonded to an exposed surface of the oxide bonding enhancement dielectric layer. The carrier substrate and the adhesive layer are removed exposing the layer of graphene.
Public/Granted literature
- US20160049475A1 GRAPHENE LAYER TRANSFER Public/Granted day:2016-02-18
Information query
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