Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14282863Application Date: 2014-05-20
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Publication No.: US09431491B2Publication Date: 2016-08-30
- Inventor: Takashi Aoki , Takahiro Korenari
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2013-124656 20130613
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L29/417 ; H01L29/66 ; H01L29/78 ; H01L23/482 ; H01L29/423 ; H01L29/06 ; H01L29/10

Abstract:
A semiconductor device including an active cell region formed over the surface of a silicon substrate and including a vertical MOSFET, a drain electrode formed over the surface of the silicon substrate and leading out the drain of the vertical MOSFET from the back surface of the silicon substrate, an external drain terminal formed over the drain electrode, and a source electrode formed over the active cell region so as to be opposed to the drain electrode at least along three sides at the periphery of the external drain terminal over the active cell region and connected to the source of the vertical MOSFET.
Public/Granted literature
- US20140367770A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-12-18
Information query
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