Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US13604962Application Date: 2012-09-06
-
Publication No.: US09431545B2Publication Date: 2016-08-30
- Inventor: Toshihiko Saito , Atsuo Isobe , Kazuya Hanaoka , Junichi Koezuka , Shinya Sasagawa , Motomu Kurata , Akihiro Ishizuka
- Applicant: Toshihiko Saito , Atsuo Isobe , Kazuya Hanaoka , Junichi Koezuka , Shinya Sasagawa , Motomu Kurata , Akihiro Ishizuka
- Applicant Address: JP Kanagawa-ken
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2011-208229 20110923; JP2011-225519 20111013
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/28 ; H01L27/12

Abstract:
A miniaturized transistor having high electric characteristics is provided with high yield. In a semiconductor device including the transistor, high performance, high reliability, and high productivity are achieved. In a semiconductor device including a transistor in which an oxide semiconductor film, a gate insulating film, and a gate electrode layer on side surfaces of which sidewall insulating layers are provided are stacked in this order, source and drain electrode layers are provided in contact with the oxide semiconductor film and the sidewall insulating layers. In a process for manufacturing the semiconductor device, a conductive film and an interlayer insulating film are stacked to cover the oxide semiconductor film, the sidewall insulating layers, and the gate electrode layer, and the interlayer insulating film and the conductive film over the gate electrode layer are removed by a chemical mechanical polishing method, so that the source and drain electrode layers are formed.
Public/Granted literature
- US20130075732A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-03-28
Information query
IPC分类: