Invention Grant
- Patent Title: Protective cover for a copper containing conductor
- Patent Title (中): 含铜导体的保护盖
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Application No.: US14440830Application Date: 2013-11-05
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Publication No.: US09431553B2Publication Date: 2016-08-30
- Inventor: Robertus Adrianus Maria Wolters , Johannes Reinder Marc Luchies , Klaas Heres
- Applicant: M4SI B.V.
- Applicant Address: NL
- Assignee: M4SI B.V.
- Current Assignee: M4SI B.V.
- Current Assignee Address: NL
- Agency: Banner & Witcoff, Ltd.
- Priority: NL2009754 20121105
- International Application: PCT/NL2013/050789 WO 20131105
- International Announcement: WO2014/070019 WO 20140508
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01L31/0216 ; H01L31/048 ; H01L31/18

Abstract:
The method of manufacturing a solar cell comprises the steps of: (a) providing the semiconductor substrate in a deposition chamber of a vapour deposition apparatus, which semiconductor substrate comprises a passivation layer at a first side thereof which passivation layer is patterned to define contact areas at which the copper-containing conductor is present; (b) supplying a gaseous silicon species into the deposition chamber, resulting in the formation of a surface layer of a copper silicide on a surface of the copper-containing conductor and in the formation of amorphous silicon on top of the passivation layer, and (c) providing a protective layer of an insulating silicon compound on the surface layer, wherein the protective cover comprising both the surface layer and the protective layer.
Public/Granted literature
- US20150295103A1 PROTECTIVE COVER FOR A COPPER CONTAINING CONDUCTOR Public/Granted day:2015-10-15
Information query
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