Invention Grant
- Patent Title: Oxide film scheme for RRAM structure
- Patent Title (中): RRAM结构的氧化膜方案
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Application No.: US14459361Application Date: 2014-08-14
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Publication No.: US09431609B2Publication Date: 2016-08-30
- Inventor: Trinh Hai Dang , Hsing-Lien Lin , Cheng-Yuan Tsai , Chia-Shiung Tsai , Ru-Liang Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L45/00

Abstract:
The present disclosure relates to a method of forming an RRAM cell having a dielectric data layer that provides good performance, device yield, and data retention, and an associated apparatus. In some embodiments, the method is performed by forming an RRAM film stack having a bottom electrode layer disposed over a semiconductor substrate, a top electrode layer, and a dielectric data storage layer disposed between the bottom electrode and the top electrode. The dielectric data storage layer has a performance enhancing layer with a hydrogen-doped oxide and a data retention layer having an aluminum oxide. The RRAM film stack is then patterned according to one or more masking layers to form a top electrode and a bottom electrode, and an upper metal interconnect layer is formed at a position electrically contacting the top electrode.
Public/Granted literature
- US20160049584A1 OXIDE FILM SCHEME FOR RRAM STRUCTURE Public/Granted day:2016-02-18
Information query
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