Invention Grant
- Patent Title: Mobile power supply
- Patent Title (中): 移动电源
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Application No.: US14552488Application Date: 2014-11-25
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Publication No.: US09431640B2Publication Date: 2016-08-30
- Inventor: Hui-Te Hsu
- Applicant: Powergene Technology Co., Ltd., Taiwan Branch
- Applicant Address: TW New Taipei
- Assignee: POWERGENE TECHNOLOGY CO., LTD. TAIWAN BRANCH
- Current Assignee: POWERGENE TECHNOLOGY CO., LTD. TAIWAN BRANCH
- Current Assignee Address: TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H01M2/10
- IPC: H01M2/10 ; H02J7/00 ; H01M10/42 ; H01M10/6554 ; H01M10/615 ; H01M2/22 ; H01M10/48 ; H01M10/623 ; H05K5/00

Abstract:
A mobile power supply includes a case, a control circuit board, a power storage module, a heating element and a thermal sheet. The case is with a hole formed thereon. The control circuit board is disposed in the case. A plurality of electrical connectors is welded on the control circuit board and is exposed by the case. The power storage module is disposed in the case and electrically connected to the control circuit board. The heating element is disposed on the case and exposed at the hole. The heating element is electrically connected to the control circuit board. The thermal sheet is attached to the case and in contact with the heating element. Thereby, the mobile power supply may provide heat and be used for heat preservation or for keeping warm.
Public/Granted literature
- US20160149176A1 MOBILE POWER SUPPLY Public/Granted day:2016-05-26
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