Invention Grant
- Patent Title: Feedthrough connector for hermetically sealed electronic devices
- Patent Title (中): 用于密封电子设备的穿通连接器
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Application No.: US14518853Application Date: 2014-10-20
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Publication No.: US09431759B2Publication Date: 2016-08-30
- Inventor: Toshiki Hirano , Vipin A. Vitikkate
- Applicant: HGST Netherlands B.V.
- Applicant Address: NL Amsterdam
- Assignee: HGST NETHERLANDS B.V.
- Current Assignee: HGST NETHERLANDS B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Kunzler Law Group, PC
- Main IPC: G11B25/04
- IPC: G11B25/04 ; H01R13/58 ; G06F1/18 ; H01R13/60 ; H01R13/52 ; G11B33/12 ; G11B33/14

Abstract:
Disclosed herein is one embodiment of an apparatus that includes a housing that defines an interior cavity. The housing also includes a spring aperture. The apparatus further includes a spring coupled to the housing over the spring aperture, with the spring having a deflection portion and a feedthrough aperture. The apparatus also has an electrical connector coupled to the spring and extending through the feedthrough aperture and the spring aperture. The electrical connector may have a plurality of electrical traces extending from a location external to the housing to a location within the interior cavity of the housing.
Public/Granted literature
- US20160111814A1 FEEDTHROUGH CONNECTOR FOR HERMETICALLY SEALED ELECTRONIC DEVICES Public/Granted day:2016-04-21
Information query
IPC分类: