Invention Grant
- Patent Title: Elastic wave device and method for manufacturing the same
- Patent Title (中): 弹性波装置及其制造方法
-
Application No.: US13920492Application Date: 2013-06-18
-
Publication No.: US09431996B2Publication Date: 2016-08-30
- Inventor: Munehisa Watanabe , Hideki Iwamoto , Hajime Kando , Syunsuke Kido
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-288453 20101224
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H9/02 ; H03H3/10

Abstract:
An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-velocity film stacked on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, the piezoelectric film is stacked on the low-acoustic-velocity film, and an IDT electrode stacked on a surface of the piezoelectric film.
Public/Granted literature
- US20130285768A1 ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-10-31
Information query
IPC分类: