Invention Grant
- Patent Title: Electronic device and conductive ground element
- Patent Title (中): 电子设备和导电接地元件
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Application No.: US14069456Application Date: 2013-11-01
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Publication No.: US09433069B2Publication Date: 2016-08-30
- Inventor: Zhong-Hui Mao , Te-Hsiung Hsieh
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: WISTRON CORPORATION
- Current Assignee: WISTRON CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Hunton & Williams LLP
- Priority: CN201210461331 20121115
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/18 ; H05F3/02

Abstract:
An electronic device includes a metallic housing having a front wall with a mounting hole communicating with an interior thereof, and a front cover spaced apart from the front wall and having an access slot corresponding in position to the mounting hole. A circuit module includes a circuit board disposed within the metallic housing and having an extension protruding out of the front wall via the mounting hole, and an electrical connector disposed on the extension. A conductive ground element is disposed pivotally within the metallic housing in proximity to the mounting hole, and abuts against the electrical connector to conduct static electricity of the electrical connector to the metallic housing.
Public/Granted literature
- US20140168912A1 ELECTRONIC DEVICE AND CONDUCTIVE GROUND ELEMENT Public/Granted day:2014-06-19
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