Invention Grant
- Patent Title: Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section
- Patent Title (中): 基板装置和电路装置，其具有垂直于第二基板部分的第一基板部分
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Application No.: US14599672Application Date: 2015-01-19
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Publication No.: US09433077B2Publication Date: 2016-08-30
- Inventor: Thomas J. Brunschwiler , Dominic Gschwend , Keiji Matsumoto , Stefano S. Oggioni , Gerd Schlottig , Timo J. Tick , Jonas Zuercher
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Matthew C. Zehrer
- Priority: ITMI2014A0224 20140214
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H05K1/02 ; H01L23/14 ; H01L23/373 ; H05K3/34 ; H05K3/40 ; H01L23/498
Abstract:
A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are angled (α) with respect to one another.
Public/Granted literature
- US20150237729A1 SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT Public/Granted day:2015-08-20
Information query
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