A layout method for a printed circuit board, comprising: defining a layout area on the printed circuit board; disposing at least one padstack on the layout area; disposing a welding material area on the padstack to partially cover the padstack and be located at one end of the padstack; disposing a blocking area on the layout area, wherein the blocking area comprises an opening to expose the padstack; and forming a wiring, wherein the wiring is connected with the padstack and the welding material area through the opening without overlapping the blocking area. The layout method for a printed circuit board and the printed circuit board may avoid that the outlet of the wiring is formed through the side of the welding material area to leave a blank area on the padstack.