Invention Grant
- Patent Title: Posterior vertebral plating system
- Patent Title (中): 后椎体电镀系统
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Application No.: US14491769Application Date: 2014-09-19
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Publication No.: US09433443B2Publication Date: 2016-09-06
- Inventor: Albert A. Montello , Hyun W. Bae , William L. Strausbaugh , Christopher M. Bonner , William P. McDonough , David K. Koch , Jordan N. Milford
- Applicant: DEPUY SYNTHES PRODUCTS, INC.
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: Dunlap Codding, P.C.
- Main IPC: A61B17/80
- IPC: A61B17/80 ; A61B17/70 ; A61B17/86

Abstract:
A posterior vertebral plating system comprising a plate and a plurality of attachment members. The plate has a plurality of holes extending through the plate from an upper surface to a lower surface, and the plate is configured to extend along the posterior side of at least two vertebrae adjacent at least one boney structure of each of the vertebrae. The holes are spaced in such a way that a first plurality of holes is positionable over a boney structure of a first vertebra to define a plurality of fixation points to the first vertebra and a second plurality of holes is positionable over boney structure of a second vertebra to define a plurality of fixation points to the second vertebra. The attachment members are insertable through the holes of the plate and into the boney structure of a corresponding vertebra to fix the plate to the vertebra.
Public/Granted literature
- US20150012039A1 POSTERIOR VERTEBRAL PLATING SYSTEM Public/Granted day:2015-01-08
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