Invention Grant
- Patent Title: Bonding wire and method for manufacturing same
- Patent Title (中): 接合线及其制造方法
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Application No.: US14335225Application Date: 2014-07-18
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Publication No.: US09434027B2Publication Date: 2016-09-06
- Inventor: Ryo Togashi
- Applicant: NIPPON MICROMETAL CORPORATION
- Applicant Address: JP Iruma-Shi, Saitama
- Assignee: NIPPON MICROMETAL CORPORATION
- Current Assignee: NIPPON MICROMETAL CORPORATION
- Current Assignee Address: JP Iruma-Shi, Saitama
- Agency: Troutman Sanders LLP
- Priority: JP2012-012778 20120125
- Main IPC: B21C37/04
- IPC: B21C37/04 ; B23K35/02 ; C22F1/00 ; C22F1/08 ; H01L23/00 ; B23K35/30 ; B32B15/01 ; C22C9/00 ; B21C1/02 ; B21C9/00 ; B23K35/22 ; B23K35/40 ; B22D11/041
Abstract:
It is an object of the present invention to provide a bonding wire capable of maintaining a structure and a configuration thereof at the time of performing wire bonding; and a manufacturing method thereof. Provided is a bonding wire having a core member mainly composed of copper; and a palladium coating layer. Particularly, formed in a center of the core member is a fibrous structure with copper crystals extending in an axial direction.
Public/Granted literature
- US20140329106A1 BONDING WIRE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2014-11-06
Information query
