Invention Grant
- Patent Title: Planarization device and planarization method using the same
- Patent Title (中): 平面化装置及其平面化方法
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Application No.: US14269370Application Date: 2014-05-05
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Publication No.: US09434045B2Publication Date: 2016-09-06
- Inventor: Yu-Hua Yeh , Liang-Yu Hu , Tang-Tsai Chang , Ming-Tsan Lai
- Applicant: Macronix International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: B24B37/04
- IPC: B24B37/04 ; B24B37/34 ; B24B55/00 ; B24B37/10

Abstract:
A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm.
Public/Granted literature
- US20150318179A1 PLANARIZATION DEVICE AND PLANARIZATION METHOD USING THE SAME Public/Granted day:2015-11-05
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