A present MEMS device includes: a substrate; a functional element that is provided on a surface of the substrate; a structural member that is provided on the surface of the substrate and forms a cavity surrounding the functional element; a first lid portion that is provided with an opening and covers a part of the cavity in such a manner that a gap is present between the first lid portion and the functional element; a receiving portion that is provided between a plurality of electrodes or a plurality of units of wiring on the surface of the substrate and has a receiving face opposing the cozening of the first lid portion via a gap; and a second lid portion including an electrically conductive sealing portion that seals the opening of the first lid portion.