Invention Grant
US09434816B2 Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer
有权
聚酰胺酰亚胺共聚物膜及聚酰胺 - 酰亚胺共聚物的制备方法
- Patent Title: Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer
- Patent Title (中): 聚酰胺酰亚胺共聚物膜及聚酰胺 - 酰亚胺共聚物的制备方法
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Application No.: US14409895Application Date: 2012-06-25
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Publication No.: US09434816B2Publication Date: 2016-09-06
- Inventor: Hyo Jun Park , Hak Gee Jung
- Applicant: Hyo Jun Park , Hak Gee Jung
- Applicant Address: KR Gwacheon-si
- Assignee: KOLON INDUSTRIES, INC.
- Current Assignee: KOLON INDUSTRIES, INC.
- Current Assignee Address: KR Gwacheon-si
- Agency: Sughrue Mion, PLLC
- International Application: PCT/KR2012/005002 WO 20120625
- International Announcement: WO2014/003210 WO 20140103
- Main IPC: C08G73/16
- IPC: C08G73/16 ; C08G73/14 ; C08J5/18 ; C09D179/08 ; C08G73/10 ; C08G63/68
Abstract:
Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bis-trifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride) and a unit structure derived from TPC (Terephthaloyl chloride; 1,4-benzenedicarbonyl chloride) are copolymerized.
Public/Granted literature
- US20150299392A1 POLYAMIDE-IMIDE COPOLYMER FILM AND METHOD OF PREPARING POLYAMIDE-IMIDE COPOLYMER Public/Granted day:2015-10-22
Information query
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