Adhesives compositions and methods of preparing adhesive compositions are described. The methods generally comprise a) providing a syrup composition comprising i) a free-radically polymerizable solvent monomer; and ii) a solute (meth)acrylic copolymer; and b) radiation curing the syrup composition in the absence of an ionic photoacid generator. In one embodiment, the solute (meth)acrylic copolymer as provided or during curing comprises repeat units derived from at least one alkyl(meth)acrylate monomer, at least one ethylenically unsaturated monomer comprising an acid-functional group; and at least one (meth)acryloyl monomer comprising an epoxy-functional group; and the acid-functional groups crosslink with the epoxy-functional groups. In another embodiment, the solute (meth)acrylic copolymer comprising repeat units derived from at least one alkyl(meth)acrylate monomer and at least one ethylenically unsaturated monomer comprising an acid-functional group; and an epoxy resin, having on average greater than one polymerizable epoxy group per molecule, crosslinks the acid-functional groups.