A monitoring system includes a plurality of modules to sense temperature and vibrations of a motor assembly, a hub computer to collect the sensed temperature and vibrations, and an analyzer computer to analyze the collected temperature and vibrations. The modules contain detectors that measure a temperature and vibrations in three axes of the motor assembly, a transceiver integrated circuit that measures a die temperature of the transceiver integrated circuit, a microcontroller integrated circuit that self-adjusts its clock pulses, and a memory that stores parameters set for the operation of the modules. The microcontroller integrated circuit and the memory are configured to check parameters corruption upon transferring the parameters from the memory to the microcontroller integrated circuit and prior to utilizing by the microcontroller integrated circuit. The microcontroller integrated circuit is also configured to perform power control operations by turning off sections of the microcontroller integrated circuit over periodic durations.