Invention Grant
- Patent Title: Integration of optical components in integrated circuits by separating two substrates with an insulation layer
- Patent Title (中): 通过用绝缘层分离两个基板将光学部件集成在集成电路中
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Application No.: US14850381Application Date: 2015-09-10
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Publication No.: US09435947B2Publication Date: 2016-09-06
- Inventor: Errol T. Ryan
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02F1/025 ; H01L21/76 ; H01L23/52 ; H01L27/06 ; H01L21/768 ; H01L23/48 ; G02B6/43 ; G02B6/122 ; H01L23/367 ; H01L23/373 ; H01L23/528 ; H01L23/532 ; H01L27/12
Abstract:
Methodologies enabling integration of optical components in ICs and a resulting device are disclosed. Embodiments include: providing a first substrate layer of an IC separated from a second substrate level by an insulator layer; providing a transistor on the second substrate layer; and providing an optical component on the first substrate layer, the optical component being connected to the transistor.
Public/Granted literature
- US20150378096A1 INTEGRATION OF OPTICAL COMPONENTS IN INTEGRATED CIRCUITS Public/Granted day:2015-12-31
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