Invention Grant
- Patent Title: Redundant power supply motherboard assembly
- Patent Title (中): 冗余电源主板组装
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Application No.: US14695547Application Date: 2015-04-24
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Publication No.: US09436233B2Publication Date: 2016-09-06
- Inventor: Michael Anthony Correll , Brian John Gillespie , Terry Lee Barber
- Applicant: Phoenix Contact Development and Manufacturing, Inc.
- Applicant Address: US PA Middletown
- Assignee: Phoenix Contact Development and Manufacturing, Inc.
- Current Assignee: Phoenix Contact Development and Manufacturing, Inc.
- Current Assignee Address: US PA Middletown
- Agency: Hooker & Habib, P.C.
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K5/00 ; G06F1/18 ; G06F1/26 ; H01T4/06 ; H05K7/14
Abstract:
A redundant power supply motherboard assembly connects control segments of a fieldbus-type control system to a host computer. The assembly has a compact design with pairs of power supply modules mounted in nests on the motherboard. The nests securely hold the modules to prevent contact impairment due to vibrations, shocks and handling.
Public/Granted literature
- US20150362964A1 Redundant Power Supply Motherboard Assembly Public/Granted day:2015-12-17
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