Invention Grant
- Patent Title: Tier based layer promotion and demotion
- Patent Title (中): 层级推广和降级
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Application No.: US14166974Application Date: 2014-01-29
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Publication No.: US09436793B2Publication Date: 2016-09-06
- Inventor: Yen-Hung Lin , Chi Wei Hu , Yuan-Te Hou , Chung-Hsing Wang , Chin-Chou Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Among other things, one or more systems and techniques for tier based layer modification, such as promotion or demotion, for a design layout are provided herein. A metal scheme describes one or more metal layers of the design layout, which are grouped into a set of tiers based upon resistivity similarity between the metal layers. Wire segments of the design layout are evaluated for promotion to tiers providing improved performance, for demotion to tiers providing decreased performance so that relatively faster routing resources are freed up for other wire segments, or for modification such as widening of wire segments. Via count penalties corresponding to timing delays of additional vias used to reassign wire segments are taken into account during promotion. Routing resource gains associated with reassigning wire segments are taken into account during demotion. In this way, wire segments of the design layout are promoted, demoted, or modified.
Public/Granted literature
- US20150213178A1 TIER BASED LAYER PROMOTION AND DEMOTION Public/Granted day:2015-07-30
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