A connector module includes a housing and a conductive lead frame. The housing includes a cover and a base that define a cavity therebetween. The cavity receives a circuit card therein. The base has a top side and a bottom side. The top side faces the cover and defines part of the cavity. Multiple windows extend through the base between the top and bottom sides. The base includes a conductive layer at least partially covered by a non-conductive layer. The conductive lead frame is coupled to the bottom side of the base. The lead frame includes multiple contact beams that extend into the cavity through the windows of the base. The lead frame is electrically isolated from the conductive layer of the base by the non-conductive layer of the base. The lead frame further includes mounting contacts configured to be mounted to conductive components of a circuit board.