Invention Grant
US09437346B2 Semiconductor device connected by anisotropic conductive adhesive film
有权
半导体器件通过各向异性导电胶膜连接
- Patent Title: Semiconductor device connected by anisotropic conductive adhesive film
- Patent Title (中): 半导体器件通过各向异性导电胶膜连接
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Application No.: US14049243Application Date: 2013-10-09
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Publication No.: US09437346B2Publication Date: 2016-09-06
- Inventor: Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kyu Bong Kim , Woo Jun Lim
- Applicant: Kyoung Hun Shin , Do Hyun Park , Hyun Joo Seo , Young Ju Shin , Kyu Bong Kim , Woo Jun Lim
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2012-0112335 20121010
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H01L23/60 ; H01L23/00
Abstract:
A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.
Public/Granted literature
- US20140097548A1 SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM Public/Granted day:2014-04-10
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