Invention Grant
- Patent Title: Waterproofing structure and waterproofing method in core wire
- Patent Title (中): 芯线防水结构及防水方法
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Application No.: US14354638Application Date: 2012-10-26
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Publication No.: US09437349B2Publication Date: 2016-09-06
- Inventor: Takahiro Saito
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2011-237658 20111028
- International Application: PCT/JP2012/078411 WO 20121026
- International Announcement: WO2013/062143 WO 20130502
- Main IPC: H01B7/282
- IPC: H01B7/282 ; H01B13/06 ; H01B7/285 ; H01R4/70

Abstract:
A waterproofing structure in a core wire includes a covered electric wire in which a plurality of core wires are covered with an insulating covering, a core wire bundle expanded portion in which the core wires of an intermediate core wire exposed portion are separated from each other and expanded in diameter by removing a part of the insulating covering, and a mold portion that is molded to surround the core wire bundle expanded portion by cooling and solidifying a thermoplastic adhesive filling between the core wires in the core wire bundle expanded portion by hot melting, together with the insulating coverings at both sides between which the intermediate core wire exposed portion is interposed.
Public/Granted literature
- US20140299353A1 Waterproofing Structure and Waterproofing Method in Core Wire Public/Granted day:2014-10-09
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