Invention Grant
- Patent Title: Hot rolled plate made of copper alloy used for a sputtering target and sputtering target
- Patent Title (中): 用于溅射靶和溅射靶的由铜合金制成的热轧板
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Application No.: US14654210Application Date: 2013-12-03
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Publication No.: US09437405B2Publication Date: 2016-09-06
- Inventor: Kiyoyuki Okubo , Masato Koide
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: JP2012-288705 20121228
- International Application: PCT/JP2013/082439 WO 20131203
- International Announcement: WO2014/103626 WO 20140703
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34 ; B21B3/00 ; C22C9/00 ; C22C9/01 ; C22C9/05 ; C22F1/08 ; B22D11/00
Abstract:
Disclosed is a hot rolled plate produced by hot rolling an ingot cast by continuous casting, in which the plate is made of a copper alloy containing 0.5 to 10.0 at % of Ca and the balance consisting of Cu and inevitable impurities and the average grain size of Cu-α phase crystal grains is 5 to 60 μm in a Cu matrix.
Public/Granted literature
- US20150318153A1 HOT ROLLED PLATE MADE OF COPPER ALLOY USED FOR A SPUTTERING TARGET AND SPUTTERING TARGET Public/Granted day:2015-11-05
Information query
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