Invention Grant
- Patent Title: Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure
- Patent Title (中): 一种电子元件封装的铝包铜结构体及一种制造具有铝包铜结构的电子元器件封装的方法
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Application No.: US14267378Application Date: 2014-05-01
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Publication No.: US09437459B2Publication Date: 2016-09-06
- Inventor: Burton J. Carpenter , Chu-Chung Lee , Tu-Anh N. Tran
- Applicant: Burton J. Carpenter , Chu-Chung Lee , Tu-Anh N. Tran
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent David G. Dolezal
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L23/498 ; H01L23/31
Abstract:
An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.
Public/Granted literature
- US20150318240A1 ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE Public/Granted day:2015-11-05
Information query
IPC分类:
