Invention Grant
- Patent Title: Array substrate and fabrication method thereof, and display device
- Patent Title (中): 阵列基板及其制造方法以及显示装置
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Application No.: US14574721Application Date: 2014-12-18
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Publication No.: US09437487B2Publication Date: 2016-09-06
- Inventor: Shi Shu , Feng Zhang , Yaohui Gu , Fang He , Feng Gu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201410697709 20141126
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/768 ; H01L27/12 ; G02F1/1362 ; G02F1/1368

Abstract:
Embodiments of the disclosure disclose an array substrate and a fabrication method thereof, and a display device. The fabrication method of the array substrate comprises: forming a thin film transistor; forming a passivation layer covering the thin film transistor, the passivation layer having a via hole and the via hole exposing at least a portion of a drain electrode of the thin film transistor; forming a via-hole conductive layer, the via-hole conductive layer covering the portion of the drain electrode exposed at the via hole and connected to the drain electrode; treating the via-hole conductive layer, so that a reflectivity of the via-hole conductive layer is lower than a reflectivity of the drain electrode; and forming a pixel electrode, the pixel electrode being connected with the drain electrode through the via-hole conductive layer.
Public/Granted literature
- US20160148838A1 ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, AND DISPLAY DEVICE Public/Granted day:2016-05-26
Information query
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