Invention Grant
- Patent Title: Method of making a FinFET device
- Patent Title (中): 制造FinFET器件的方法
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Application No.: US14057789Application Date: 2013-10-18
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Publication No.: US09437497B2Publication Date: 2016-09-06
- Inventor: Ming-Feng Shieh , Weng-Hung Tseng , Tzung-Hua Lin , Hung-Chang Hsieh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L27/088 ; H01L21/02 ; H01L21/311 ; H01L21/8234

Abstract:
A method of fabricating a fin-like field-effect transistor device is disclosed. The method includes forming mandrel features over a substrate and performing a first cut to remove mandrel features to form a first space. The method also includes performing a second cut to remove a portion of mandrel features to form a line-end and an end-to-end space. After the first and the second cuts, the substrate is etched using the mandrel features, with the first space and the end-to-end space as an etch mask, to form fins. Depositing a space layer to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the first space and the end-to-end space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the first space and the end-to-end space and an isolation trench is formed in the first space and the end-to-end space.
Public/Granted literature
- US20150111362A1 Method Of Making A FinFET Device Public/Granted day:2015-04-23
Information query
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