Invention Grant
- Patent Title: Wireless module and production method for wireless module
- Patent Title (中): 无线模块的无线模块和生产方法
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Application No.: US14388349Application Date: 2014-01-29
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Publication No.: US09437535B2Publication Date: 2016-09-06
- Inventor: Maki Nakamura , Suguru Fujita
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2013-014606 20130129
- International Application: PCT/JP2014/000464 WO 20140129
- International Announcement: WO2014/119302 WO 20140807
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L23/31 ; H01L21/56 ; H01L21/48 ; H01L23/66 ; H05K3/36 ; H05K1/14 ; H05K1/18 ; H05K3/46

Abstract:
Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.
Public/Granted literature
- US20150332997A1 WIRELESS MODULE AND PRODUCTION METHOD FOR WIRELESS MODULE Public/Granted day:2015-11-19
Information query
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