Invention Grant
- Patent Title: Semiconductor device package and method of manufacturing the same
- Patent Title (中): 半导体器件封装及其制造方法
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Application No.: US14665800Application Date: 2015-03-23
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Publication No.: US09437576B1Publication Date: 2016-09-06
- Inventor: Tau-Jing Yang , Kuo-Feng Huang , Wei Yu Nien
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaosiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaosiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu; Angela D. Murch
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/552 ; H01L23/538 ; H01L23/31 ; H01L25/00
Abstract:
A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.
Public/Granted literature
- US20160284665A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-09-29
Information query
IPC分类:
