Invention Grant
- Patent Title: Flip chip semiconductor device
- Patent Title (中): 倒装芯片半导体器件
-
Application No.: US14158830Application Date: 2014-01-19
-
Publication No.: US09437587B2Publication Date: 2016-09-06
- Inventor: Xiaotian Zhang , Hamza Yilmaz , Jun Lu , Xiaoguang Zeng , Ming-Chen Lu
- Applicant: Alpha and Omega Semiconductor Incorporated
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Chein-Hwa S. Tsao
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/00 ; H01L21/78 ; H01L25/16 ; H01L23/495 ; H01L25/07
Abstract:
A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a recess area formed in the first chip installation area, and multiple metal pillars formed in the recess area, a notch divides the first chip installation area into a transverse base extending transversely and a longitudinal base extending longitudinally, and separates the recess area into a transverse recess part formed in the transverse base and a longitudinal recess part formed in longitudinal base; a portion of a transverse extending part connecting to an external pin extends into a portion inside of the notch.
Public/Granted literature
- US20150206868A1 FLIP CHIP SEMICONDUCTOR DEVICE Public/Granted day:2015-07-23
Information query
IPC分类:
