Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14056351Application Date: 2013-10-17
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Publication No.: US09437672B2Publication Date: 2016-09-06
- Inventor: Naoya Okamoto
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2013-014553 20130129
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L29/417 ; H01L29/66 ; H01L29/778 ; H01L29/20

Abstract:
A semiconductor device includes: a first semiconductor layer of a nitride semiconductor formed on a substrate; a second semiconductor layer of a nitride semiconductor formed on the first semiconductor layer; and a gate electrode, a source electrode, a drain electrode, and a hole extraction electrode, each of which is formed on the second semiconductor layer, wherein between the source electrode and the hole extraction electrode or in a region right under the source electrode, the first semiconductor layer and the second semiconductor layer form a vertical interface approximately perpendicular to a surface of the substrate, and a surface of the first semiconductor layer configured to form the vertical interface is an N-polar surface.
Public/Granted literature
- US20140209893A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-07-31
Information query
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