Invention Grant
- Patent Title: Semiconductor device using three dimensional channel
- Patent Title (中): 半导体器件采用三维通道
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Application No.: US14803265Application Date: 2015-07-20
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Publication No.: US09437730B2Publication Date: 2016-09-06
- Inventor: Kwan-Young Kim , Jae-Hyun Yoo , Jin-Hyun Noh , Woo-Yeol Maeng , Yong-Woo Jeon
- Applicant: Kwan-Young Kim , Jae-Hyun Yoo , Jin-Hyun Noh , Woo-Yeol Maeng , Yong-Woo Jeon
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2014-0163378 20141121
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/423 ; H01L29/08 ; H01L27/088

Abstract:
According to example embodiments, a semiconductor device includes a first fin, a second fin that is separated from the first fin, and a gate on the first fin and the second fin. The gate crosses the first fin and the second fin. The first fin includes a first doped area at both sides of the gate. The first doped area is configured to have a first voltage applied thereto. The second fin includes a second doped area at both sides of the gate. The second doped area is configured to have a second voltage applied thereto. The second voltage is different than the first voltage.
Public/Granted literature
- US20160149030A1 SEMICONDUCTOR DEVICE USING THREE DIMENSIONAL CHANNEL Public/Granted day:2016-05-26
Information query
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