A device includes a conductive surface (12) and electrical contacts (14) by which an electric current is able to be passed. The electrical contacts (14) include conductive seeds (16) deposited on the conductive surface (12), an electrically insulating layer (18), which covers discontinuously the conductive seeds (16) in order to form openings leaving access to the conductive seeds (16), and a plating layer (22) recovering the discontinuous insulating layer (18) and deposited on conductive seeds (16) which are accessible through the openings and form points from which the deposit of the plating layer (22) can start. The rest of the conductive surface (12), which doesn't include any electrical contacts (14), is continuously covered by the electrically insulating layer (18).