Invention Grant
- Patent Title: Light-emitting device and peeling method
- Patent Title (中): 发光装置和剥离方法
-
Application No.: US14621914Application Date: 2015-02-13
-
Publication No.: US09437832B2Publication Date: 2016-09-06
- Inventor: Tatsuya Sakuishi , Yutaka Uchida , Hiroki Adachi , Saki Eguchi , Junpei Yanaka , Kayo Kumakura , Seiji Yasumoto , Kohei Yokoyama , Akihiro Chida
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2014-029756 20140219
- Main IPC: H01L51/00
- IPC: H01L51/00 ; B32B7/02 ; B32B38/10 ; B32B7/12 ; B32B15/08 ; B32B15/18 ; B32B15/20 ; B32B17/00 ; B32B27/20 ; B32B27/28 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; B32B37/02 ; B32B37/18 ; B32B37/12 ; H01L51/52
Abstract:
A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
Public/Granted literature
- US20150236280A1 LIGHT-EMITTING DEVICE AND PEELING METHOD Public/Granted day:2015-08-20
Information query
IPC分类:
