Invention Grant
- Patent Title: Dual band antenna pair with high isolation
- Patent Title (中): 双频天线对具有高隔离度
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Application No.: US13779697Application Date: 2013-02-27
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Publication No.: US09437935B2Publication Date: 2016-09-06
- Inventor: Javier R. DeLuis , Alireza Mahanfar , Benjamin Shewan , Mark Casebolt , Jeff Reents
- Applicant: Microsoft Corporation
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agent Gregg Wisdom; Judy Yee; Micky Minhas
- Main IPC: H01Q21/28
- IPC: H01Q21/28 ; H01Q1/52 ; H01Q21/24

Abstract:
A dual band printed antenna pair operates simultaneously at both WLAN frequency bands (2.4 GHz/5 GHz). The antenna pair provides high isolation between both antennas while having an efficient over the air performance. The antenna pair achieve greater than 20 dB isolation at 2.4 GHz and 5 GHz band, while having antennas positioned in close proximity. The high isolation is accomplished using an orthogonal antenna configuration (exploiting orthogonal polarization) and a parasitic element to further enhance isolation at 2.4 GHz. The antenna pair and parasitic element are printed on a Printed Circuit Board (PCB) adding relatively little cost to the Radio Frequency (RF) interface. The PCB is then fixed on top of a metal chassis with the antenna keep out area overhanging a corner of the metal chassis to enhance performance.
Public/Granted literature
- US20140242903A1 DUAL BAND ANTENNA PAIR WITH HIGH ISOLATION Public/Granted day:2014-08-28
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